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PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

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Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

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Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts
Zirconia used for wear resistant parts, heat resistant parts

Zirconia used for wear resistant parts, heat resistant parts
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

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Wafer slicing (cutting) refers to the process of cutting a single wafer into multiple independent chips (" dies ").

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The entire semiconductor manufacturing process is very common and indispensable, what is it used for?

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