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Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

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Zirconia used for wear resistant parts, heat resistant parts

Zirconia used for wear resistant parts, heat resistant parts
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields
Ceramic structural parts (ceramic parts)

Ceramic structural parts (ceramic parts)
Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry
Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

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Ceramic end effector(ceramic finger, ceramic robot arm)

Ceramic end effector(ceramic finger, ceramic robot arm)
Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance
PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
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Wafer adsorption technology is a seemingly trivial but crucial link. Whether etched, deposited or lithographed, wafers must be stably and precisely fixed in the right position to ensure efficient ...

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