Ke noi a me nā hiʻohiʻona o ka papa porous chuck
ʻO nā seramika porous nā seramika me nā puka he nui i loko o ka waiwai ponoʻī ma o ka ʻenehana sintering seramika, a hoʻohana ʻia i loko o nā suckers vacuum. I kēia mau lā, ua hoʻohana nui ʻia ma ke ʻano he kumu kumu no nā huahana ʻoihana like ʻole, e like me nā kānana, refractory, kiln wares, absorbers, sound absorbers, lightweight structural material, insulation material, etc. kiʻekiʻe precision a me kiʻekiʻe vacuum. Loaʻa iā ia ka hiki ke komo i nā mea ultra-thin, i koi ʻia no ka hana ʻana o nā semiconductors, LED a me nā hōʻike. He mea koʻikoʻi loa ka porous ceramics i ka porosity kiʻekiʻe a mālama i ka ikaika kiʻekiʻe. ʻOi loa i ka semiconductor a me ka ʻoihana pale hōʻike, pono e loaʻa i nā seramika porous ka porosity like ʻole a me ka ʻili o ka ʻili maikaʻi i ʻole e hōʻino i ka mea hoʻomoe. He mau inoa like ʻole ka porous ceramic vacuum sucker:
1. ʻO ka mea hoʻoheheʻe ʻana i ka lepo
2、 Papa lana ea
3、 Porous ceramic vacuum sucker
4、 Precision porous ceramic kūloko adsorption vacumm sucker
5、 ʻO ka mea hoʻoheheʻe ʻana i ka ʻuala
6 、 Papaʻaʻa chuck seramika porous
7、 Precision porous ceramic wahi mea hoʻoheheʻe lepo
8、 Porous ea lana papaʻaina
9、 Paʻa pākaukau chuck seramika porous
ʻO ke kumu hana o ka porous ceramic vacuum sucker:
No ka mea ʻoi aku ka liʻiliʻi o nā pores o nā seramika porous, i ka wā e hoʻokomo ʻia ai ka ʻili o ka mea hana i ka sucker vacuum, ʻaʻole ia e hoʻoulu i ka ʻili, nā niho a me nā mea ʻino ʻē aʻe ma muli o ke kaomi ʻino. Ma o ka hui pū ʻana o ke kumu metala (a i ʻole ka ceramic) a me nā seramika porous kūikawā, ʻo ka hoʻolālā hoʻoheheʻe ʻana o ka ea i loko e hiki ai i ka mea hana ke hoʻomaʻamaʻa a paʻa paʻa ma luna o ka ʻūhā ʻūhā ke hoʻohana ʻia ke kaomi ʻino.
Palapala noi
1. Kūikawā ceramic vacuum sucker module no ka omo planar workpiece
2, ʻO Adsorption a hiki i ka hapalua o ka wahi ʻaʻole e uhaʻi i ka ʻōpala
3, He kūpono i ke kaiapuni maʻemaʻe no ka hana ʻana i ka mīkini a i ʻole ka hana ʻana o ka hale hana, hui a i ʻole ʻoihana automation
4, Semiconductor wafer sucker, ʻoihana micro chip, ʻoki, wili, hoʻomaʻemaʻe, etc.
5, TFT-LCD, ʻoihana lako LED.
6, Mīkini hōʻike, mīkini ʻoki aniani, aniani substrate ea e lana ana.
7, Pa'i kaapuni papa lako 'oihana.
8, ʻoihana hana lima lima mīkini.
9, ʻO ke kōmike hoʻopaʻa haʻahaʻa haʻahaʻa, hoʻolaʻa ʻia no ka hopu ʻana i ka mea hana mokulele.
10, Inā hiki iā ʻoe ke mālama i ka hapalua o ka wahi, a laila ʻaʻole e nalowale ka mea paʻa i ka mea hana. Hiki i nā mea hana he nui ke hoʻohana i ka pahu seramika like.
Nā hiʻohiʻona
1, ʻO ke kūpaʻa maikaʻi: nā hiʻohiʻona paʻakikī, ke kūpaʻa ʻana, ʻaʻole maʻalahi i ka ʻōpala a me ka pōʻino.
2, ʻAʻole maʻalahi ka decompose a me ka lepo: ua hoʻopaʻa ʻia nā keramika, paʻa a paʻa ka hale, ʻaʻohe lepo.
3, Māmā: ʻO nā mea māmā a me ka hoʻolālā o loko he porosity like, ʻoi loa ke kaumaha.
4, Adsorption āpana: hiki ke hoʻopili i nā nui like ʻole o ka mea hana ma ka papa hana seramika like.
5, Ke kūpaʻa wela kiʻekiʻe, ke kūpaʻa kemika: ʻo nā ceramics nā huahana sintering kiʻekiʻe, maikaʻi ka wela wela a me ka acid & alkali resistance, kahi ākea o nā noi.
6, Hana uila kiʻekiʻe: me ka insulation, dissipating electrostatic hiʻohiʻona (e pili ana i ka mea).
7, Nā nui like ʻole: maikaʻi kekahi ʻano a me ka nui.
He maikaʻi nā seramika porous me ka porosity kiʻekiʻe, akā ʻoi aku ka kiʻekiʻe o ka porosity, ʻoi aku ka haʻahaʻa o ka ikaika o ka mea. Eia kekahi, i ka haʻahaʻa haʻahaʻa o ka pore, e liʻiliʻi ka porosity a i ʻole ka nui o ka pore ma ka porosity like. No laila, ʻoi aku ka ikaika o nā mea me ka pore haʻahaʻa. ʻO nā seramika Porous he mau seramika me ka nui o nā pores i loko o ka mea, i hoʻohana ʻia no nā mea hoʻoheheʻe vacuum ma o ka ʻenehana sintering ceramic.
ʻO ka porous ceramic chuck kekahi o nā huahana nui o Singapore Fountyl Technologies PTE Ltd., R&D a me ka hana ʻana no ia ʻano huahana no nā makahiki he 10, ʻo ka mea nui he porous ceramics, nā mea nui o nā mea he alumina a me ka silicon carbide, hoʻohana ʻia i loko o nā wafers silika, nā wafers hui semiconductor, aniani, piezoelectric ceramics, LED, semiconductor packaging component substrate, optical component thinning, cutting field.