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Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

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Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

Alumina ceramics with excellent plasma corrosion resistance and high wear resistance
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
Ceramic structural parts (ceramic parts)

Ceramic structural parts (ceramic parts)

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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
Quartz glass melted with various kinds of pure natural quartz

Quartz glass melted with various kinds of pure natural quartz
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
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Application and characteristics of porous chuck table

Porous chuck table, also known as: porous ceramic vacuum suckerIt is composed of a metal (or ceramic) base and a special porous ceramic combination, the internal precision air conduction design, w...

What is the difference between substrate and epitaxy?

In the semiconductor industry chain, especially in the third generation semiconductor (wide band gap semiconductor) industry chain, there will be a substrate and epitaxial layer, what is the signi...

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