Tsev
Cov khoom
Aluminium silicon carbide structural ib feem siv rau aviation, aerospace, Marine ships, rail transit, tshiab zog tsheb teb
Kev sib piv ntawm cov khoom ntawm AISIC nrog tsoos hlau thiab cov ntaub ntawv ceramic:
| aluminium alloy (7050) | titanium alloy (TC4) | Stainless hlau (SUS304) | SIC | Alumina | AISiC | |
| Qhov ceev (g / cm3) | 2.8 | 4.5 | 7.9 ib | 3.2 | 3.97 ib | 2.8-3.2 |
| Lub zog ntawm extension (MPa) | ≥496 | ≥985 | ≥520 | - | - | 270-450 : kuv |
| Elasticity Modulus (Gpa) | 69 | 110 | 210 | 330 | 300 | 160-280 : kuv |
| Bending zog (Mpa) | - | - | - | 350-600 Nws | 290 | 230-450 Nws |
| Coefficient ntawm linear expansion (× 10 / ℃) | nees nkaum plaub | 8.6 | 17.3 ib | 4.5 | 7.2 | 4.5-16 |
| Thermal conductivity (W / m · K) | 154-180 : kuv | 8 | 15 | 126 | 20 | 163-255 : kuv |
Qhov nruab nrab thiab siab lub cev aluminium silicon carbide composite cov ntaub ntawv peb tau txais los ntawm kev npaj ua haujlwm tshiab uas tsis muaj theem cuam tshuam, uas ua tau zoo kom tsis txhob muaj qhov tsis zoo ntawm cov khoom siv hlau ceramic, thiab txhim kho kev ua tau zoo thiab kev siv ntau yam ntawm cov ntaub ntawv.
1. Aluminium silicon carbide - cov khoom siv
High-strength precision structural qhov chaw - nrog rau cov yam ntxwv ntawm lub teeb yuag, siab nruj, seem stability, hnav tsis kam thiab corrosion kuj, es tsis txhob ntawm aluminium alloy, stainless hlau, titanium alloy, siv nyob rau hauv high-precision, hnav-resistant yam ntxwv qhov chaw nrog counterweight yuav tsum. .
| Qhov ceev (g / cm3) | Bending zog (MPa) | Modulus ntawm elasticity (GPa) | Tus nqi elongation (%) | Damping ratio (ζ,%) | Thermal conductivity (W / m·K) @ 25 ℃ | Coefficient ntawm linear expansion (× 10 / ℃) 25-200 ℃ | |
| S45 SiC/AI | 2.925 ib | 298 | 172 | 1.2 | 0.42 ib | 203 | 11.51 Nws |
| S50 SiC/AI | 2.948 ib | 335 | 185 | / | 0.52 ib | 207 | 10.42 Nws |
| S55 SiC/AI | 2.974 ib | 405 | 215 | / | 0.66 ib | 210 | 9.29 ib |
| S60 SiC/AI | 2.998 ib | 352 ib | 230 | / | 0.7 ua | 215 | 8.86 ib |
2. Aluminium silicon carbide - tshav kub dissipation ib feem
Microelectronic cooling substrate/plhaub: aluminium silicon carbide yog lub npe hu ua lub cim thib peb ntawm cov khoom siv hluav taws xob ntim rau nws cov khoom siv hluav taws xob zoo tshaj plaws, thiab tau siv dav hauv kev ntim khoom hluav taws xob (thawj tiam xws li txhuas, tooj liab; tiam thib ob xws li Raws li Kewa, tooj liab molybdenum, tooj liab tungsten alloy .... thiab lwm yam).
| Qhov ceev (g / cm) | Bending zog (MPa) | Modulus ntawm elasticity (GPa) | Thermal conductivity (W / m·K) @ 25 ℃ | Coefficient ntawm linear expansion (× 10 ° / ℃) 25-200 ° ℃ | |
| T60 SIC/AI | 2.998 ib | 260 | 229 | 220 | 8.64 ib |
| T65 SIC/AI | 3.018 ib | 255 | 243 | 236 | 7.53 ib |
| T70 SIC/AI | 3.05 Nws | 251 | 258 | 217 | 6.8 |
| T75 SIC/AI | 3.068 ib | 257 | 285 | 226 | 5.98 ib |
Cov khoom lag luam zoo: Cov thermal conductivity siab, nto muaj nuj nqi sib txawv tsim, Tsawg thermal expansion coefficient (zoo ib yam li thermal expansion coefficient ntawm cov khoom nti) Tsawg vuam porosity.
IGBT pob hauv paus phaj: Lub thermal conductivity ntawm aluminium silicon carbide yog siab thiab qis thermal expansion coefficient (thermal expansion coefficient zoo ib yam li cov khoom siv nti), txo qhov tshwm sim ntawm pob hluav taws xob tawg, txhim kho lub neej kev pab cuam ntawm cov khoom. Nyob rau hauv high-speed tsheb ciav hlau, lub zog tshiab tsheb, radar, cua zog tsim los hloov txhuas, tooj liab, tooj liab tungsten, tooj liab molybdenum, beryllium, ceramics thiab lwm yam microelectronics ntim khoom.
| Khoom siv | Qhov ceev (g / cm *) | Coefficient ntawm linear expansion (x 10 ° / ° C) | Thermal conductivity (W / m · K) | Kev nruj nruj (Gpa cm / g) |
| AISIC | 2.8-3.2 | 4.5-16 | 163-255 : kuv | 76-108 : kuv |
| Nrog | 8.9 ib | 17 | ib 393 | 5 |
| TSI (6061) | 2.7 | nees nkaum peb | 171 | 25 |
| Phau ntawv | 8.3 | 5.9 | 14 | 16 |
| Invar | 8.1 | 1.6 | 11 | 14 |
| Cu/Mo(15/85) | 10 | 7 | 160 | 28 |
| Cu/W (15/85) | 17 | 7.2 | 190 | 16 |