Us announces 3D semiconductor roadmap

SEMICONDUCTOR RESEARCH CORPORATION (SRC) has unveiled its Microelectronics and Advanced Packaging (MAPT) roadmap, developed by a collaborative effort of about 300 individuals from 112 organizations in industry, academia and government.

The MAPT roadmap defines key research priorities and technical challenges that must be addressed to support the major transformation outlined in the Semiconductor Decade Plan, released in January 2021. The MAPT roadmap, available at https://srcmapt.org/, is the first industry-wide 3D semiconductor roadmap to guide the coming microelectronics revolution.

The development of the MAPT roadmap was funded in April 2022 by the U.S. Department of Commerce's National Institute of Standards and Technology (NIST), and SRC was selected to lead this effort. "The contribution and effort of such a wide range of scientists, engineers and researchers to the development and formulation of the MAPT roadmap shows the importance of this work," said Dr. Victor Zhirnov, Chief scientist at SRC and Director of the MAPT Roadmap.

Ever-shrinking components and assemblies are facing fundamental physical limits, and the next generation of breakthroughs cannot be achieved without significant advances. The Semiconductor Decade Plan 2030, released by SRC and the Semiconductor Industry Association (SIA), identifies five major changes in the industry related to smart sensing, memory and storage, communications, security and energy-efficient computing. By design, the 10-year plan is not a concrete solution; It clarifies what the future requires, rather than how to achieve and accomplish it.

The MAPT roadmap was developed to comprehensively consider the fundamental and practical constraints of ICT sustainability (including energy sustainability, environmental sustainability and workforce sustainability), discuss how to achieve its system-level objectives based on the Semiconductor Decade Plan, and outline implementation plans for the semiconductor industry. Basic research for the MAPT roadmap focuses on advanced packaging, 3D integration, electronic design automation, nanoscale manufacturing, new materials, and energy-efficient computing.

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