Aluminium silicon carbide structrual part yomwe imagwiritsidwa ntchito popanga ndege, ndege, Sitima zapamadzi, zoyendera njanji, gawo lamagalimoto amphamvu atsopano.
Kuyerekeza kwa katundu wa AISIC ndi zitsulo zachikhalidwe ndi zida za ceramic:
zitsulo zotayidwa (7050) | titaniyamu aloyi (TC4) | zitsulo zosapanga dzimbiri (SUS304) | SIC | Alumina | AISiC | |
Kachulukidwe (g/cm3) | 2.8 | 4.5 | 7.9 | 3.2 | 3.97 | 2.8-3.2 |
Mphamvu yowonjezera (MPa) | ≥496 | ≥985 | ≥520 | - | - | 270-450 |
Elasticity modulus (Gpa) | 69 | 110 | 210 | 330 | 300 | 160-280 |
Mphamvu yopindika (Mpa) | - | - | - | 350-600 | 290 | 230-450 |
Coefficient of linear expansion(×10/℃) | makumi awiri ndi mphambu zinayi | 8.6 | 17.3 | 4.5 | 7.2 | 4.5-16 |
Thermal conductivity (W/m·K) | 154-180 | 8 | 15 | 126 | 20 | 163-255 |
Sing'anga ndi mkulu thupi zotayidwa silicon carbide gulu zipangizo tinatengera pa mtundu watsopano kukonzekera ntchito popanda gawo mawonekedwe, amene bwino amapewa zofooka za brittleness zitsulo ceramic gulu zipangizo, ndi bwino kwambiri processing ntchito ndi ntchito zosiyanasiyana zipangizo.
1. Aluminium silicon carbide - zigawo zamapangidwe
Zida zamapangidwe amphamvu kwambiri - zokhala ndi mawonekedwe opepuka, owuma kwambiri, kukhazikika kwamkati, kukana kuvala ndi kukana dzimbiri, m'malo mwa aluminium alloy, chitsulo chosapanga dzimbiri, aloyi ya titaniyamu, yogwiritsidwa ntchito mwatsatanetsatane kwambiri, zigawo zamapangidwe zosavala zokhala ndi zofunikira zofananira. .
Kachulukidwe (g/cm3) | Mphamvu yopindika (MPa) | Modulus of elasticity (GPa) | Mlingo wa elongation (%) | Chiŵerengero cha Damping(ζ,%) | Thermal conductivity(W/m·K)@25℃ | Coefficient of linear expansion (× 10 / ℃) 25-200 ℃ | |
S45 SiC/AI | 2.925 | 298 | 172 | 1.2 | 0.42 | 203 | 11.51 |
S50 SiC/AI | 2.948 | 335 | 185 | / | 0.52 | 207 | 10.42 |
S55 SiC/AI | 2.974 | 405 | 215 | / | 0.66 | 210 | 9.29 |
S60 SiC/AI | 2.998 | 352 | 230 | / | 0.7 | 215 | 8.86 |
2. Aluminiyamu silicon carbide - kutentha dissipation gawo
Microelectronic kuzirala gawo lapansi/chipolopolo: aluminium silicon carbide imadziwika kuti m'badwo wachitatu wa zida zama CD zamagetsi chifukwa cha zinthu zake zotentha kwambiri, ndipo imagwiritsidwa ntchito kwambiri popanga zida zamagetsi (m'badwo woyamba monga aluminium, mkuwa; M'badwo wachiwiri wotere monga Kewa, copper molybdenum, copper tungsten alloy....etc).
Kachulukidwe (g/cm) | Mphamvu yopindika (MPa) | Modulus of elasticity (GPa) | Thermal conductivity(W/m·K) @25℃ | Coefficient of linear expansion(×10°/℃) 25-200°℃ | |
T60SIC/AI | 2.998 | 260 | 229 | 220 | 8.64 |
T65SIC/AI | 3.018 | 255 | 243 | 236 | 7.53 |
T70SIC/AI | 3.05 | 251 | 258 | 217 | 6.8 |
T75SIC/AI | 3.068 | 257 | 285 | 226 | 5.98 |
Ubwino wazinthu: Kutentha kwapamwamba kwambiri, kapangidwe kake kosiyanasiyana, kocheperako kawotchi kakang'ono (kofanana ndi kuchuluka kwa matenthedwe azinthu za chip) Kutsika kowotcherera kwa porosity.
IGBT phukusi loyambira mbale: The matenthedwe madutsidwe zitsulo zotayidwa silicon carbide ndi mkulu ndi otsika matenthedwe kufutukula koyenera (matenthedwe coefficient ofanana ndi chip chuma), bwino kuchepetsa kuthekera kwa phukusi akulimbana akulimbana, kusintha moyo utumiki wa mankhwala. Mu njanji yothamanga kwambiri, magalimoto amagetsi atsopano, radar, magetsi opangira magetsi kuti alowe m'malo mwa aluminiyamu, mkuwa, tungsten yamkuwa, molybdenum yamkuwa, beryllium, ceramics ndi zida zina zonyamula ma microelectronics.
Zipangizo | Kachulukidwe (g/cm*) | Kukula kwa mzere (x 10°/ ° C) | Thermal conductivity (W/m·K) | Kuuma kwapadera (Gpa cm/g) |
AISIC | 2.8-3.2 | 4.5-16 | 163-255 | 76-108 |
Ndi | 8.9 | 17 | 393 | 5 |
AI (6061) | 2.7 | makumi awiri ndi mphambu zitatu | 171 | 25 |
Journal | 8.3 | 5.9 | 14 | 16 |
Invar | 8.1 | 1.6 | 11 | 14 |
Ku/Mo(15/85) | 10 | 7 | 160 | 28 |
Ku/W(15/85) | 17 | 7.2 | 190 | 16 |