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OEM Aluminum Silicon Carbide Structural Parts Made in Southeast Asia

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Quartz glass melted with various kinds of pure natural quartz

Quartz glass melted with various kinds of pure natural quartz

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Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

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Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts
Alumina ceramics with excellent plasma corrosion resistance and high wear resistance

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PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
Wafer pin chuck used for semiconductor exposure device and wafer inspection device

Wafer pin chuck used for semiconductor exposure device and wafer inspection device
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry
Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams
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Chemical mechanical polishing (CMP) is a technique used in the fabrication of integrated circuit chips to achieve wafer surface flatness

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