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High-Quality OEM Materials Made From Ceramics for Durable Products

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

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Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields

Aluminum silicon carbide ceramics used for aerospace, automotive, military, electronics, sports utensil fields
Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field
Microporous Ceramic Vacuum Chuck

Microporous Ceramic Vacuum Chuck
Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
High precision ceramic piston for new energy and medical fields

High precision ceramic piston for new energy and medical fields
Zirconia used for wear resistant parts, heat resistant parts

Zirconia used for wear resistant parts, heat resistant parts

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Ceramic end effector(ceramic finger, ceramic robot arm)

Ceramic end effector(ceramic finger, ceramic robot arm)
Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry
Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field
Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

Beryllium oxide ceramics with high thermal conductivity and low loss characteristics
Silicon nitride ceramic with excellent physical, chemical, and mechanical properties

Silicon nitride ceramic with excellent physical, chemical, and mechanical properties
Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit
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The main method and technology of Die Bonding

Die bonding is a process for mounting a chip on a package substrate. This paper introduces several main chip bonding methods and processes in detail.

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