OEM Method of Processing Ceramics: Innovative Solutions for Manufacturing

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

Ceramic structural parts (ceramic parts)

Porous air floating platform with the load transfer technology of non-contact mode for semiconductor industry

Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Aluminum silicon carbide structrual part used for aviation, aerospace, Marine ships, rail transit, new energy vehicles field

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OEM Method of Processing Ceramics: Innovative Solutions for Manufacturing

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