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Aluminium silicon carbide structrual part inoshandiswa kune avhiyesheni, aerospace, Marine ships, njanji yekufambisa, itsva simba mota ndima.
Kuenzanisa kwezvivakwa zveAISIC nesimbi yechinyakare uye ceramic zvinhu:
| aruminiyamu chiwanikwa (7050) | titanium alloy (TC4) | tsvina isina tsvina (SUS304) | SIC | Alumina | AISiC | |
| Density (g/cm3) | 2.8 | 4.5 | 7.9 | 3.2 | 3.97 | 2.8-3.2 |
| Simba rekuwedzera (MPa) | ≥496 | ≥985 | ≥520 | - | - | 270-450 |
| Elasticity modulus (Gpa) | 69 | 110 | 210 | 330 | 300 | 160-280 |
| Simba rekubhenda (Mpa) | - | - | - | 350-600 | 290 | 230-450 |
| Coefficient yekuwedzera kwemutsara (× 10 / ℃) | makumi maviri nemana | 8.6 | 17.3 | 4.5 | 7.2 | 4.5-16 |
| Thermal conductivity (W/m·K) | 154-180 | 8 | 15 | 126 | 20 | 163-255 |
Iyo yepakati nepamusoro yemuviri aluminium silicon carbide inoumbwa zvinhu zvatakatora pamhando nyowani yekugadzira gadziriro isina chiratidziro chikamu, iyo inodzivirira zvinobudirira kukanganisa kweiyo brittleness yesimbi ceramic composite zvinhu, uye inovandudza zvakanyanya mashandiro uye mashandisirwo emhando yezvigadzirwa.
1. Aluminium silicon carbide - zvimiro zvikamu
Yakakwirira-yakasimba yakanyatso kurongeka zvikamu - zvine hunhu hwehuremu, kuomarara kwepamusoro, kugadzikana kwedimensional, kupfeka kuramba uye kusagadzikana kwemarara, pachinzvimbo chealuminium alloy, simbi isina tsvina, titanium alloy, inoshandiswa mukurongeka kwepamusoro-soro, kusapfeka-inodzivirira mativi ane huremu zvinodiwa. .
| Density (g/cm3) | Kubhenda simba (MPa) | Modulus ye elasticity (GPa) | Chiyero chekurebesa (%) | Damping ratio(ζ,%) | Thermal conductivity(W/m·K)@25℃ | Coefficient yekuwedzera kwemutsara (× 10 / ℃) 25-200 ℃ | |
| S45 SiC/AI | 2.925 | 298 | 172 | 1.2 | 0.42 | 203 | 11.51 |
| S50 SiC/AI | 2.948 | 335 | 185 | / | 0.52 | 207 | 10.42 |
| S55 SiC/AI | 2.974 | 405 | 215 | / | 0.66 | 210 | 9.29 |
| S60 SiC/AI | 2.998 | 352 | 230 | / | 0.7 | 215 | 8.86 |
2. Aluminium silicon carbide - kupisa kupisa chikamu
Microelectronic cooling substrate/shell: aluminium silicon carbide inozivikanwa sechizvarwa chechitatu chemagetsi ekurongedza zvinhu zvemhando yepamusoro yekupisa kwemuviri, uye inoshandiswa zvakanyanya mumunda wekurongedza zvemagetsi (chizvarwa chekutanga sealuminium, mhangura; Chizvarwa chechipiri chakadaro. seKewa, mhangura molybdenum, copper tungsten alloy....etc).
| Density(g/cm) | Kubhenda simba (MPa) | Modulus ye elasticity (GPa) | Thermal conductivity(W/m·K) @25℃ | Coefficient yekuwedzera kwemutsara(×10°/℃) 25-200°℃ | |
| T60SIC/AI | 2.998 | 260 | 229 | 220 | 8.64 |
| T65SIC/AI | 3.018 | 255 | 243 | 236 | 7.53 |
| T70SIC/AI | 3.05 | 251 | 258 | 217 | 6.8 |
| T75SIC/AI | 3.068 | 257 | 285 | 226 | 5.98 |
Zvibereko zvechigadzirwa: High thermal conductivity, surface function diversified design, Low thermal expansion coefficient (yakafanana neiyo thermal yekuwedzera coefficient ye chip material) Low welding porosity.
IGBT package base plate: Thermal conductivity yealuminium silicon carbide yakakwira uye yakaderera kupisa kwekuwedzera kweyekupisa coefficient (mafuta ekuwedzera coefficient akafanana neiyo chip zvinhu), zvinonyatso dzikisa mukana wepakeji kutsemuka, kunatsiridza hupenyu hwesevhisi yechigadzirwa. Muchitima chinomhanya-mhanya, mota nyowani dzesimba, radar, kugadzirwa kwesimba remhepo kutsiva aluminium, mhangura, tungsten yemhangura, mhangura molybdenum, beryllium, ceramics uye mamwe mamicroelectronic ekurongedza zvinhu.
| Zvishandiso | Density (g/cm*) | Coefficient yekuwedzera kwemutsara (x 10°/ ° C) | Thermal conductivity (W/m·K) | Kuomarara chaiko (Gpa cm/g) |
| AISIC | 2.8-3.2 | 4.5-16 | 163-255 | 76-108 |
| With | 8.9 | 17 | 393 | 5 |
| AI (6061) | 2.7 | makumi maviri nenhatu | 171 | 25 |
| Journal | 8.3 | 5.9 | 14 | 16 |
| Invar | 8.1 | 1.6 | 11 | 14 |
| Cu/Mo(15/85) | 10 | 7 | 160 | 28 |
| Cu/W(15/85) | 17 | 7.2 | 190 | 16 |