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Beryllium oxide ceramics with high thermal conductivity and low loss characteristics

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

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Beryllium oxide ceramic parts used for auto and semiconductor and large integrated circuit

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Aluminum nitride ceramic used for heat dissipating parts and corrosion resistant parts

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Silicon carbide used for corrosion resistant parts, seals parts, high temperature resistant parts, guide rails and square beams

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PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability

PEEK material with high-performance engineering plastic in excellent heat resistance, chemical resistance, mechanical strength and dimensional stability
Microporous Ceramic Vacuum Chuck

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Quartz glass structural part used for semiconductor, optics, optical communication, photovoltaic and LED field

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Electrostatic chuck with compatibility, high-density, hight structural strength with customized

Electrostatic chuck with compatibility, high-density, hight structural strength with customized
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