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I-wafer pin chuck esetyenziselwa isixhobo sokuvezwa kwe-semiconductor kunye nesixhobo sokuhlola i-wafer
Iimbonakalo
Ukumelana nobushushu obuphezulu:I-silicon carbide kunye nezixhobo ze-alumina ceramic zinomgangatho ophezulu wokusebenza kobushushu obuphezulu, zingasetyenziswa kwindawo yobushushu obuphezulu ixesha elide, akukho lula ukuguqulwa okanye ukwaphuka.
Ukuchasa umhlwa:inokumelana neentlobo ezahlukeneyo zokubola kweekhemikhali, ezifanelekileyo zokuphatha ulwelo oludlekayo okanye iigesi kwindawo yokusebenza.
Ukumelana nokunxiba:ubunzima obuphezulu, kunye nokumelana nokunxiba kakuhle, kunokusetyenziswa ixesha elide ngaphandle kokusilela.
I-adsorption eyomeleleyo:Isakhiwo sendawo yeconvex sinciphisa indawo yoqhagamshelwano yekomityi yokufunxa, ngaloo ndlela sandise amandla e-adsorption kwindawo nganye yeyunithi, kwaye inokuthengisa ngokuqinileyo i-workpiece.
Uzinzo oluphezulu:Ngenxa yeempawu zezinto eziphathekayo, i-wafer pin chuck inozinzo oluphezulu kwaye inokusebenza ngokuzinzileyo ixesha elide.
Nciphisa ungcoliseko:I-Ceramic wafer chucks isuka kwi-grooves ukuya kwizikhonkwane ukunciphisa indawo yoqhagamshelwano, ukunciphisa ungcoliseko oluthile kunye nokuphucula ukulungiswa kokulwa.
Ulawulo Lwenkqubo
Ukuchaneka okuphezulu: i-intshi eyi-12 ububanzi, ukunyameka kulawulwa ngaphakathi kwe-5 μm; Ukuba ufuna ukuchaneka ngakumbi, nceda usithumelele i-imeyile.
Ulawulo lwemilo: Lungisa imilo ye-chuck ngokwemilo ye-wafer (ulawulo olungafaniyo).
Ukuphendula kwe-Absorptive: Uyilo olulungiselelwe ngokweenkcukacha.
Iinkonzo zethu
Ukukhethwa kwe-wafer pin chuck kufuneka kuthathelwe ingqalelo ngokwemiba emininzi efana nedayamitha efunekayo yeekomityi zokufunxa, inani lamanqaku econvex, kunye nokumila kwe-chuck, kwaye wenze ukhetho olufanelekileyo ngokobungakanani, ubunzima be-adsorption. into kunye neemfuno zendawo yokusebenza.
Samkele itekhnoloji yomatshini womatshini ochanekileyo, siphumeza uyilo loyilo lwesiko, kwaye sibonelela ngeyona pinni ilungileyo ye-wafer pin chuck ukuhlangabezana neemfuno ezingqongqo zabathengi.
Ubume obucaba be-pin chuck bunokulungelelaniswa ngokukhululekileyo ngokwemilo ye-wafer, kwaye indawo ye-adsorption okanye ipateni ye-pin ingenziwa ngokwezifiso ukuphucula ukuphendula kwe-adsorption.
Izinto eziphathekayo: I-aluminium oxide ceramic okanye i-silicon carbide inokukhethwa, kwaye i-DLC kunye neTeflon inokugqithwa phezu komhlaba.
I-SiC/SSiC wafer pin chucks echaneke kakhulu iphuhliselwa ukuvezwa kwe-wafer, ukuhlolwa, iinkqubo zothutho ezibhetyebhetye kakhulu, ezisicaba kakhulu, kwaye zixhathisa ngokugqithisileyo kwiindawo zokusebenza ezirhabaxa.
Idatha yoVavanyo oluchanekileyo
![sdw (2) wzk](https://ecdn6.globalso.com/upload/p/277/image_other/2024-01/6597c7d26042625053.jpg)
![sdw (3) pwr](https://ecdn6.globalso.com/upload/p/277/image_other/2024-01/6597c7c404fe578289.jpg)
![0af19965-9b3b-4d8d-b343-2a7da016f7d7(1)84c](https://ecdn6.globalso.com/upload/p/277/image_other/2024-01/6597d73dc695f48825.jpg)
Isicelo
Ukulungiswa kwe-wafer yesixhobo sokuvezwa kwe-semiconductor; Ukulungiswa kwe-wafer yesixhobo sokuhlola i-wafer.