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Ingxenye yesakhiwo se-aluminium silicon carbide esetshenziselwa izindiza, i-aerospace, imikhumbi yasolwandle, ezokuthutha ngojantshi, inkambu yezimoto zamandla amasha

Imikhiqizo

Ingxenye yesakhiwo se-aluminium silicon carbide esetshenziselwa izindiza, i-aerospace, imikhumbi yasolwandle, ezokuthutha ngojantshi, inkambu yezimoto zamandla amasha

Kokubili izinzuzo zokusebenza kwe-aluminium alloy nezinto zobumba, kodwa futhi kugwema ngempumelelo ukushiyeka kokusebenza kwento eyodwa, endizeni, indiza, imikhumbi yasolwandle, ezokuthutha ngojantshi, izimoto ezintsha zamandla kanye nezinye izinkambu zobuchwepheshe obuphezulu zinezinhlobonhlobo zamathemba okufaka isicelo. .


Izici zezinto ezibonakalayo: ukuqina okuqondile okuphezulu, amandla athile aphezulu, ukuzinza okuphezulu kwe-dimensional, i-coefficient ephansi yokwandisa okushisayo, ukumuncwa okuhle kwamagagasi, ukumelana nokugqoka okuphezulu, ukumelana nokugqwala... njll.

    Ukuqhathaniswa kwezakhiwo ze-AISIC ngensimbi yendabuko nezinto zobumba:

    ingxubevange ye-aluminium (7050) ingxubevange ye-titanium(TC4) i-stainless stee(SUS304) I-SIC I-Alumina I-AISiC
    Ukuminyana (g/cm3) 2.8 4.5 7.9 3.2 3.97 2.8-3.2
    Amandla esandiso (MPa) ≥496 ≥985 ≥520 - - 270-450
    I-Elasticity modulus (Gpa) 69 110 210 330 300 160-280
    Amandla okugoba (Mpa) - - - 350-600 290 230-450
    I-coefficient yokunwetshwa komugqa(×10/℃) amashumi amabili nane 8.6 17.3 4.5 7.2 4.5-16
    I-Thermal conductivity (W/m·K) 154-180 8 15 126 20 163-255


    Izinto eziyinhlanganisela ye-aluminium ye-silicon carbide ephakathi nendawo nephezulu esizithathele ekulungiseni umsebenzi wohlobo olusha ongenaso isigaba sokusebenzisana, okugwema ngempumelelo ukushiyeka kokuqina kwezinto eziyinhlanganisela yensimbi yobumba, futhi kuthuthukisa kakhulu ukusebenza kokucubungula kanye nobubanzi bokusetshenziswa kwezinto.

    1. I-aluminium silicon carbide - izingxenye zesakhiwo
    Izingxenye zesakhiwo ezinembayo ezinamandla aphezulu - ezinezici zesisindo esingasindi, ukuqina okuphezulu, ukuzinza kwe-dimensional, ukumelana nokugqokwa nokumelana nokugqwala, esikhundleni se-aluminium alloy, insimbi engagqwali, ingxubevange ye-titanium, esetshenziswa ngokunemba okuphezulu, izingxenye zesakhiwo ezingagugi ezinezidingo eziphikisanayo. .


    Amapharamitha wokusebenza wezinhlanganisela zevolumu ephezulu ye-AISiC


    Ukuminyana (g/cm3) Amandla okugoba(MPa) I-Modulus of elasticity (GPa) Izinga lobude (%) I-Damping ratio(ζ,%) I-Thermal conductivity(W/m·K)@25℃ I-coefficient yokunwetshwa komugqa(×10/℃) 25-200℃
    I-S45 SiC/AI 2.925 298 172 1.2 0.42 203 11.51
    I-S50 SiC/AI 2.948 335 185 / 0.52 207 10.42
    I-S55 SiC/AI 2.974 405 215 / 0.66 210 9.29
    I-S60 SiC/AI 2.998 352 230 / 0.7 215 8.86


    Izinzuzo zomkhiqizo: isisindo esilula, ukuqina okuphezulu, ukuzinza okuhle kwe-dimensional, umjikelezo wezinga lokushisa eliphezulu neliphansi akulula ukuwohloka, ungacubungula inkimbinkimbi, isakhiwo esinodonga oluncane, izimbobo zokunemba ezincane, i-whorl


    2. I-aluminium silicon carbide - ingxenye yokushisa ukushisa
    I-Microelectronic cooling substrate/igobolondo: i-aluminium silicon carbide yaziwa njengesizukulwane sesithathu sezinto zokupakisha ze-elekthronikhi ngenxa yezakhiwo zayo ezishisayo ezishisayo, futhi isetshenziswa kabanzi emkhakheni wokupakisha ngogesi (isizukulwane sokuqala njenge-aluminium, ithusi; Isizukulwane sesibili esinjalo njenge-Kewa, i-molybdenum yethusi, ingxube ye-tungsten yethusi .... njll).


    Ukuminyana(g/cm) Amandla okugoba(MPa) I-Modulus of elasticity (GPa) I-Thermal conductivity(W/m·K) @25℃ I-coefficient yokunwetshwa komugqa(×10°/℃) 25-200°℃
    I-T60SIC/AI 2.998 260 229 220 8.64
    I-T65SIC/AI 3.018 255 243 236 7.53
    I-T70SIC/AI 3.05 251 258 217 6.8
    I-T75SIC/AI 3.068 257 285 226 5.98


    Izinzuzo zomkhiqizo: I-thermal conductivity ephezulu, i-surface function diversified design, I-coefficient yokwandisa ukushisa okuphansi (okufana ne-coefficient yokwandisa okushisayo kwezinto ze-chip) I-porosity ye-welding ephansi.

    Ipuleti lesisekelo sephakheji le-IGBT: I-thermal conductivity ye-aluminium silicon carbide iphezulu futhi iphansi ye-thermal expansion coefficient (i-thermal expansion coefficient ifana nempahla ye-chip), inciphisa ngempumelelo amathuba okuqhekeka kwesekethe yephakheji, ithuthukise impilo yesevisi yomkhiqizo. Kusitimela esinesivinini esikhulu, izimoto zamandla amasha, i-radar, ukukhiqiza amandla omoya esikhundleni se-aluminium, ithusi, i-tungsten yethusi, i-copper molybdenum, i-beryllium, i-ceramics nezinye izinto zokupakisha ze-microelectronics.


    Ukuqhathaniswa kwamapharamitha wokusebenza we-AISIC nezinye izinto zokupakisha


    Izinto zokwakha Ukuminyana (g/cm*) I-coefficient yokunwetshwa komugqa(x 10°/ ° C) I-Thermal conductivity (W/m·K) Ukuqina okuqondile(Gpa cm/g)
    I-AISIC 2.8-3.2 4.5-16 163-255 76-108
    Nge 8.9 17 393 5
    I-AI (6061) 2.7 amashumi amabili nantathu 171 25
    Ijenali 8.3 5.9 14 16
    I-Invar 8.1 1.6 11 14
    I-Cu/Mo(15/85) 10 7 160 28
    I-Cu/W(15/85) 17 7.2 190 16