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I-Microporous Ceramic Vacuum Chuck
Izici ze-Ceramic vacuum chuck
Ukungena okuqinile: ukungena komoya okufanayo kanye nokungena kwamanzi, ukuqinisekisa amandla afanayo kanye nokukhangisa okuqinile kwe-silicon wafer ohlelweni lokugaya ngaphandle kwesilayidi.
Isakhiwo esiminyene nesifanayo: Ukwamukelwa kwe-micro-porous ceramic material enesakhiwo esiminyene nesifanayo, okungelula ukukhanga uthuli lwe-silicon, futhi i-chuck kulula ukuyihlanza.
Amandla aphezulu: akukho ukuguqulwa ngesikhathi sokugaya, ukuqinisekisa ukuthi i-wafer ye-silicon igcizelelwe ngokulinganayo endaweni ngayinye lapho igaya, futhi akulula ukwenzeka izenzakalo zokuwa komphetho, imfucumfucu.
Impilo ende: ukugcinwa komumo ongaphezulu kuhle, umjikelezo wokugqoka mude futhi inani lokugqoka lincane, ngakho-ke unokuphila okuphezulu.
Ukugqoka okulula: ngeke kube nokuqhekeka, ukuhlukana, izenzakalo zokubhula lapho ugqoka.
I-Lightweight: Ngenxa yesakhiwo sangaphakathi sama-pores, i-gravity coefficient ethile ingu-1.6-2.8.
I-insulation ephezulu: i-insulating material, susa ugesi omile.
Ukulawula Ukunemba
| isigaba | Izinto eziyisisekelo | I-Adsorption surface material | Usayizi | Ukucaba | ukujula kokuhambisana |
| I-Porous chuck | I-aluminium Alloy | I-SIC enezimbotshana | ≤12μm | ≤15μm | ≤20μm |
| Insimbi engagqwali | ≤10μm | ≤15μm | |||
| I-Alumina | ≤5μm | ≤8μm | |||
| I-Silicon Carbide | ≤3μm | ≤8μm | |||
| I-porous ceramic chuck inohlu oluphelele lokucaciswa nosayizi, olungasetshenziswa kulayini ongu-3-intshi, umugqa wama-intshi angu-4, umugqa wama-intshi angu-5, umugqa wama-intshi angu-6, umugqa wama-intshi angu-8 nomugqa wamayintshi angu-12, futhi kungenziwa egcizelele ngokusho ezibekiweko namasayizi owadingayo. | |||||
| Usayizi omkhulu wecala lamanje: 1600 * 1600m, ukujiya kungu-50mm; | |||||
Izici ze-Porous Ceramic material:
Izithako eziyinhloko: i-alumina Umbala: omnyama, ompunga wensimbi
Okuqukethwe kwe-Alumina: 92% Okuqukethwe umswakama: 0%
Imbobo: 2 ~ 30um Porosity: 35 ~ 40%
Amandla okugoba :6kgf/cm2 (Mpa) Isilinganiso sevolumu: 2.28g/cm3
Uhlobo lwe-Ceramic chuck
Ngokusho kokusetshenziswa, i-ceramic chuck ihlukaniswe yaba:
Umshini wokuncisha ofakwe: i-abrasive disc chuck, i-silicon wafer, i-sapphire substrate nokunye ukucwenga;
Umshini wokusika ufakwe: i-scribing chuck, i-silicon wafer, i-semiconductor wafer compound nokunye ukusika;
Umshini wokuhlanza ufakwe: i-chuck yokuhlanza;
Umshini wokukhipha ifilimu ufakwe: i-chuck yokukhipha ifilimu;
Laminating umshini ifakwe: laminating chuck;
Umshini wokuphrinta ufakwe: i-printing chuck.
Ukuqinisekisa ikhwalithi
I-Fountyl inesipiliyoni seminyaka eminingi yobuchwepheshe bokunemba kwe-ceramic yobunjiniyela kanye nokucubungula nokukhiqiza ukunemba okuphezulu, amathuluzi ahlukahlukene okuhlaziya angokwenyama namakhemikhali namathuluzi okulinganisa ejometri, ukuze kuqinisekiswe ukuzinza kokukhiqizwa nokuvumelana komkhiqizo we-ceramic chuck.
Isicelo somkhiqizo
I-Porous chuck (ithebula elisebenzayo le-adsorption) liyingxenye esetshenziswa esigabeni sokukhiqiza se-semiconductor futhi ihlanganiswe emshinini wokubhala noma idivayisi yokuhlola. Kungumkhiqizo ongasebenzisa isakhiwo esinezimbotshana nokucindezela okungekuhle kwendawo yebhentshi ukuze kugcinwe isicwecwana esincanyana se-silicon sicaba. Umshini wokubhala usika iwafa ye-silicon ngobubanzi obucishe ibe ngu-20μm, ngakho-ke imfuneko yokuba flat kanye nokuhambisana kwendawo ye-wafer adsorption iphezulu kakhulu. Ngokwezici zazo ezihlukene, izakhiwo zembotshana ezihlukene zinezigaba ezihlukene zokusebenzisa, njenge-ceramics encane enendawo enkulu ethize kanye nosayizi omncane wembotshana, evame ukusetshenziswa ekuhlungeni amagciwane nezinkambu zokulungisa ama-microbial; I-ceramics ye-Mesoporous enokusabalalisa kwawo okuqondile kobubanzi ngokuvamile isetshenziselwa ukuhlukanisa, izinkambu ze-adsorption catalysis. Ama-ceramics ama-macroporous ngokuvamile afanele ukuhlungwa okungalungile kwezinto ezinokuqukethwe okukhulu nosayizi omkhulu.