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Chip industry. Technical terms and abbreviations. Graphic analysis of nouns

Why is China so successful in electronics manufacturing and assembly? Most people would say it's because of low labor costs. But Apple CEO Tim Cook says this is one of the biggest misconceptions about manufacturing electronics in China. "In the fact, China stopped being a low labor cost country years ago," Cook explained at the Fortune Technology conference. "The biggest attraction for us is the quality of the people."

Porous ceramics chuck are also called nanoporous vacuum chuck, which refers to the uniform solid or vacuum sphere produced by a special nano powder manufacturing process, and a large number of connected or closed ceramic materials are generated inside the material through high temperature sintering.

High density ceramic vacuum chuck (porous ceramic vacuum chuck), a special porous ceramic material with a pore size of 2 to 3 microns, is not easy to block, high vacuum force, part of the area adsorption, but also can be used as an air floating platform, widely used in semiconductors, panels, laser process and non-contact linear slide.

Electrostatic sucker , also known as electrostatic chuck (ESC, e-Chuck), is a fixture that uses the principle of electrostatic adsorption to hold and fix the adsorbed object, suitable for vacuum and plasma environment.

Silicon carbide (SiC) is considered as an alternative material for silicon (Si) -based semiconductors in the electronics industry due to its wide band gap, high mechanical strength and high thermal conductivity. SiC power devices caoperate at higher voltages, frequencies, and temperatures, and are able to convert power with higher efficiency or lower power losses.

High purity graphite has high temperature resistance, good electrical conductivity and chemical stability, and has become a key material in the semiconductor field.

On February 19, Cisco said it would cut 5% of its global workforce, more than 4,000 working post , and lower its annual revenue target because of tough economic conditions.

The key technologies and equipment of integrated circuit manufacturing mainly include lithography technology and lithography equipment, film growth technology and equipment, chemical mechanical polishing technology and equipment, high-density post-packaging technology and equipment, all involve motion control technology and drive technology with high efficiency, high precision and high stability. The accuracy of structural parts and the performance of structural materials have very high requirements.

In the wafer manufacturing process, the wafer needs to be heated to a certain temperature, and the wafer temperature uniformity has a very strict requirement, because the wafer temperature uniformity has a very important impact on the quality of semiconductor chips; At the same time, it is also necessary to work in vacuum, plasma, chemical gas environments, which requires the use of ceramic heaters.