Advanced packaging, where is "advanced"?

What is Advanced and Traditional Packaging?

Traditional packaging is the early method of chip packaging, generally through the wire, the chip is installed on the substrate packaging method. The process is simple and the cost is low. The main packaging forms are DIP, QFP, SOP, BGA and so on.

The reason why advanced packaging is called "advanced" is mainly reflected in the following aspects:

1, high integration, advanced packaging technology can integrate multiple chips in a package body, and can also stack multiple chips vertically, significantly reducing package size and weight.

2, the process method is more diverse, and the traditional packaging is different, the practice of advanced packaging combines the characteristics of semiconductor manufacturing process and traditional packaging process, the process is more flexible, for the front and back processes need to have a certain understanding, in order to understand the advanced packaging process.

3, better conductive and thermal performance. Vertical interconnect reduces the signal transmission distance between chips and improves signal speed and reliability.

What are the common types of advanced packaging

1，Flip chip

2,  System-in-Package

3, 2.5D and 3D IC package

4，WLP(Fan-In ,Fan-Out )

5，POP(Package on a package)

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