【 Micro and Nano processing 】 The key role of vacuum chuck in wafer fixation

Principle of vacuum chuck technology

Vacuum chuck is a device that uses the vacuum principle to achieve non-damage fixing of objects. In the field of semiconductor manufacturing, this technology is cleverly applied to the fixation of wafers, and this contact-free fixation effectively avoids mechanical damage and contamination of the wafer surface. The wafer is precisely placed on the flat surface of the chuck, which is designed with a dense network of tiny pores that act as miniature "airways" to connect to the external vacuum pump system. When the vacuum pump is activated, a powerful suction force through these channels quickly pulls the air between the chuck and the wafer, creating a vacuum area below the wafer that is well below the external atmospheric pressure. According to Bernoulli's principle, the high external atmospheric pressure firmly presses the wafer on the surface of the chuck, which realizes the stable fixation of the wafer during the processing.

Structure design of vacuum chuck

Vacuum chuck are designed with the rigors of semiconductor manufacturing in mind, including flatness, corrosion resistance, thermal stability and cleanliness. Semiconductor vacuum chuck are typically made of high-performance materials such as high-purity aluminum alloys or ceramics, which have excellent corrosion resistance, thermal stability and mechanical strength to ensure that impurities are not introduced or undesirable thermal stress is generated in high-precision machining environments. At the same time, the design of the micro-pores on the surface of the chuck needs to be precisely machineed to ensure the uniformity of the airflow distribution and the stability of the suction. In addition, the chuck is equipped with an adjustable fixture system to handle different wafer sizes for fast and precise wafer positioning.

What are the specific advantages of vacuum chuck?

- Cost effective
Vacuum chuck offer significant cost advantages over other types of wafer fixtures. On the one hand, its structure is relatively simple, manufacturing and maintenance costs are low; On the other hand, due to the efficient vacuum fixing method, the risk of wafer damage caused by traditional mechanical clamping is avoided, and the scrap rate and reprocessing cost are reduced. In addition, vacuum chuck have a long service life and can maintain high accuracy and stability after multiple uses, further reducing long-term operating costs.

- High accuracy and stability
In semiconductor manufacturing, even small deviations in wafers can have a huge impact on chip performance. Through its unique vacuum adsorption mechanism, the vacuum chuck realizes the absolute stable fixation of the wafer in the process of processing, and effectively reduces the processing error caused by vibration, displacement and other factors. At the same time, the high smoothness design of the chuck surface ensures good contact between the wafer and the processing tool, further improving the accuracy and consistency of the processing.

- Strong adaptability

As semiconductor technology continues to evolve, wafer sizes and processing processes are also evolving. With its flexible design and wide compatibility, vacuum chuck can easily adapt to different sizes and types of wafers, as well as diverse processing needs. Whether it is microfabrication, lithography, etching or packaging and testing, vacuum chuck provide a stable and reliable wafer fixation solution.

The application of vacuum chuck in semiconductor manufacturing

- Photolithography technique

lithography is one of the most complex and critical processes in semiconductor manufacturing, which determines the precise pattern of circuits on a chip. During lithography, the wafer must be precisely fixed to ensure accurate exposure, alignment, and etching. With its excellent fixing performance and stability, the vacuum chuck has become an indispensable part of the lithography machine. It ensures that the wafer is always stable during high-speed rotation and precision alignment, providing a strong guarantee for the successful implementation of the lithography process.

- Etching and deposition processes

In processes of etching and deposition, wafers also need to be stabilized to avoid pattern distortion due to vibration or displacement. The vacuum chuck provides an ideal wafer support platform for these processes through its uniform suction distribution and stable fixation effect. Especially in high precision machining processes such as dry etching and atomic layer deposition, the excellent performance of vacuum chuck plays a key role. 

- Packaging and testing stage

In the later stage of semiconductor manufacturing, packaging and testing are important links to ensure the normal function and reliable quality of the chip. In these processes, the wafer or chip also needs to be precisely fixed for various testing and packaging operations. With its flexible clamping system and stable fixation performance, vacuum chuck provide an efficient wafer fixation solution for package test lines.

With the continuous advancement of semiconductor technology and the continuous upgrading of manufacturing processes, the requirements for wafer fixtures will also be more stringent. As an important part of semiconductor manufacturing, vacuum chuck technology will require higher and higher precision in wafer fixing with the decreasing of chip feature size. In the future, vacuum chuck technology will pay more attention to improving key indicators such as flatness, suction uniformity and thermal stability. In order to meet the increasingly demanding environmental requirements in semiconductor manufacturing, the material selection of vacuum chuck will pay more attention to high purity, corrosion resistance, high temperature resistance characteristics. The application of new ceramic materials, polymer composite materials and nanotechnology will bring higher performance and longer service life for vacuum chuck. In the future, vacuum chuck technology will develop in the direction of modularity and customization, and meet the needs of different process flows and wafer sizes through flexible module combinations and personalized customization, improving the flexibility and adaptability of the production line.

Market status of vacuum chuck

According to the survey data of Jianle Chambo 168Report, the global market size of porous ceramic vacuum chuck for semiconductor wafers in 2021 is about 182.42 million US dollars, and is expected to reach 277.53 million US dollars by 2028, with a compound annual growth rate (CAGR) of 5.86%. Among them, the Chinese market will account for 17.67% of the global market share in 2021 and is expected to maintain rapid growth in the next few years.

At present, the major manufacturers of porous ceramic vacuum chuck for semiconductor wafers in the global market include Disco, NTK CERATEC CO., LTD., Tokyo Seimitsu and Kyocera. These vendors hold leading positions with their advanced technology and market share. At the same time, with the continuous breakthrough of domestic technology, such as the semiconductor vacuum chuck developed by Shanghai University Shaoxing Research Institute successfully broke the foreign monopoly, the competitiveness of domestic manufacturers in the market is also gradually improving. The global market of porous ceramic vacuum chuck for semiconductor wafers is becoming increasingly competitive. While improving technical strength, domestic manufacturers also need to strengthen brand building and market expansion capabilities to cope with the pressure of international competition.

Fountyl Technologies PTE Ltd., is located in Singapore, utilize nearly 20 years of technology accumulation in the semiconductor field and has extensive experience in the design and process of ceramic vacuum chuck, ceramic arms, ceramic square beams, ceramic guides, etc. Based on an established design and process team, Fountyl offers a full range of technical services for advanced ceramic products in the semiconductor field. Excellent equipment condition, excellent equipment capability, and can be multi-process cooperation development, efficient evaluation, high-quality implementation, the whole process collection of experimental data, detailed process management and superior service.