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High-quality Reaction Bonded Sic Chuck for Precision Machining

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Porous silicon carbide chuck(reaction bonded SiC chuck, sintered silicon carbide chuck)

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Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.

Ring groove chuck is widely used in semiconductor production equipment to absorb, fix, transfer and handle the silicon wafers, wafers and various workpieces and materials.
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